The POU3500 program offers dynamic temperature control of the process chamber cathode / electrode / anode and may be synchronized with any etch approach.

30% of its peak electric power consumption, giving our prospects considerable reduction in operating fees and elevated dependability.

the data down below is classified by semiconductor course of action and Device maker. Every single table involves an purposes Matrix that displays qulified and professional processes.

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LAUDA-Noah will, for your purchaser's retrofit evaluation, observe and modify its fluid temperature Regulate profiles to match an present TCUs' as a way to ensure a sleek process integration by way of DAQ.

The accuracy with the POU 3300 allows for impartial Charge of the process fluid temperature into the wafer chuck within just +/- 0.1 °C of established point, and also the quick reaction time from the technique enables for maximum wafer-to-wafer repeatability through the etch system.

The accuracy of the POU 3500 permits unbiased Charge of the procedure fluid temperature for the wafer chuck within just +/- 0.1 °C of established place, along with the quick response time on the method will allow for maximum wafer-to-wafer repeatability all through the etch method.

While using the POU3300, you are able to achieve unprecedented brings about etch efficiency, chamber uptime, lessened expense of possession and fab Area utilization – all although enhancing your process trustworthiness.

The data pertains to your 300mm chamber temperature profile in the course of a substantial factor ratio Etch procedure, running at extremely substantial RF electric power ailments (~3.8kW). The compelling facets of this data established are:

Dynamic Temperature Control, as executed in programs such as the LAUDA-Noah POU, is an method that senses the temperature of the method fluid coming back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of the equipped method fluid dependant on this real-time comments.

The TEs' can switch straight from heating to cooling, or visa-versa. They can turn on & off even though inside the heating or cooling manner and might maximize or lessen the amount of heating or cooling without switching by any means.

greater than ever, shrinking device geometries, demanding new procedures plus a remarkably aggressive surroundings need temperature Regulate devices that Mix quickly and correct temperature control with the emphasis on lowered operating costs and improved dependability.

The reality is accurate Dynamic Temperature Management can only be attained when all 5 (five) of the next system design and style and set up specifications are satisfied:

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We demand click here much less cooling/heating capacity for the same software as being a static TCU on account of our tiny reservoir quantity.